Overmolding for electronic component encapsulation
Development of a transparent overmolding process to protect and encapsulate critical electronic components on printed circuit boards (PCBs).
The challenge
The main challenge involved encapsulating sensitive electronic components, such as microcontrollers and sensors, through plastic injection without damaging the connections or the integrity of the PCB. Extreme precision in injection pressures was required to ensure a watertight, transparent seal allowing visibility of LED indicators and access to USB connectors.
The solution
Specific tooling was developed for the overmolding of transparent technical polymers onto advanced electronics. The solution provided a robust "Prototype v3.1" encapsulation, protecting internal components from external agents while maintaining the full functionality of data and power ports.
Results
- Advanced technical protection for STM32F4 microcontrollers and associated components.
- Functional transparent encapsulation allowing visual inspection and use of light indicators.
- Maintenance of data and power signal integrity following the injection process.